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CMSCについて

沿革

2023
  • listing and trading on Taiwan Emerging Stock Market on December 5,2023
  • First public release take effect on September 26, 2023
  • Capital at par value increase to NT$ 457M
  • “Japan Kyushu-Taiwan Semiconductor Exchange Delegation” visit CMSC to exchange views on IC design service development and collaboration
2022
  • Tape out an automotive highly integrated interior LED lighting ASIC project
  • Sign a memorandum of cooperation with College of Information and Electrical Enginnering, Feng Chia University to promote industry-iniversity collaboration and talents cultivation
2021
  • Tape out an AI special opearand processor project used 12nm technology
  • Tape out an automotive AI SoC design project for a Japan customer
  • Sign a memorandum of cooperation with Providence University to promote industry-iniversity collaboration and talents cultivation
  • Join TSIA (Taiwan Semiconductor Industry Association)
2020
  • Tape out a 12nm project
2019
  • Tape out 28nm/22nm projects
  • Penetrate to the automotive field
2018
  • Tape out a factory automotion ASIC-3 design project for a Japan customer
  • Increase facility space for business growth
  • CMSC official website of new revision is on the line
2017
  • Tape out an information security SoC design project for a Korea customer
2016
  • Tape out a factory automotion ASIC-2 design project for a Japan customer
2015
  • Tape out a multimedia SoC design project, with high complexity used in a professional camera, for a Japan customer
2014
  • Tape out a factory automotion ASIC-1 design project for a Japan customer
2013
  • Tape out a 40nm project
2012
  • Tape out an SSD SoC design project for a Japan customer
  • Tape out an ASIC design of ultra low noise analog front-end project for a Japan customer
2011
  • Launch an SiP design service
2010
  • Tape out a 55nm project
  • Increase facility space for business growth
2009
  • “R&D project in Smart Microwave Sensor and RF SoC Product”received R&D subsidy from “Leading New Product Development Project”of Bureau of Industry, Ministry of Economic Affairs
2008
  • Capital at par value increase to NT$ 397M
2007
  • Obtain an ISO9001 certification
  • Qualified by Fujitsu as its design service partner
2006
  • Tape out a 65nm project
  • Capital at par value increased to NT$ 297M
  • Qualified by ARM as its approved design center
2005
  • First 90nm project tape out
  • Complete a 180nm ASIC design service for a Japan IDM
2004
  • Sign an agreement with MIPS as its authorized design partner
  • Capital at par value increase to NT$ 227M
  • Deliver the most competitive RISC CPU hard core to MIPS
  • “Development project in DDR II 500 MHz registered buffer”received R&D subsidy from “Innovation Award”of Hsinchu Science Park Bureau
2003
  • Approved to register in and move to Hsin-chu Science Park
  • Invite strategic investors (VIS & CIDC) to restructure CMSC (total Cadence shares thus transfered to VIS & CIDC)
2001
  • A design service company, 100% founded by Cadence Design Systems Inc. and located in Taiwan