listing and trading on Taiwan Emerging Stock Market on December 5,2023
First public release take effect on September 26, 2023
Capital at par value increase to NT$ 457M
“Japan Kyushu-Taiwan Semiconductor Exchange Delegation” visit CMSC to exchange views on IC design service development and collaboration
2022
Tape out an automotive highly integrated interior LED lighting ASIC project
Sign a memorandum of cooperation with College of Information and Electrical Enginnering, Feng Chia University to promote industry-iniversity collaboration and talents cultivation
2021
Tape out an AI special opearand processor project used 12nm technology
Tape out an automotive AI SoC design project for a Japan customer
Sign a memorandum of cooperation with Providence University to promote industry-iniversity collaboration and talents cultivation
Join TSIA (Taiwan Semiconductor Industry Association)
2020
Tape out a 12nm project
2019
Tape out 28nm/22nm projects
Penetrate to the automotive field
2018
Tape out a factory automotion ASIC-3 design project for a Japan customer
Increase facility space for business growth
CMSC official website of new revision is on the line
2017
Tape out an information security SoC design project for a Korea customer
2016
Tape out a factory automotion ASIC-2 design project for a Japan customer
2015
Tape out a multimedia SoC design project, with high complexity used in a professional camera, for a Japan customer
2014
Tape out a factory automotion ASIC-1 design project for a Japan customer
2013
Tape out a 40nm project
2012
Tape out an SSD SoC design project for a Japan customer
Tape out an ASIC design of ultra low noise analog front-end project for a Japan customer
2011
Launch an SiP design service
2010
Tape out a 55nm project
Increase facility space for business growth
2009
“R&D project in Smart Microwave Sensor and RF SoC Product”received R&D subsidy from “Leading New Product Development Project”of Bureau of Industry, Ministry of Economic Affairs
2008
Capital at par value increase to NT$ 397M
2007
Obtain an ISO9001 certification
Qualified by Fujitsu as its design service partner
2006
Tape out a 65nm project
Capital at par value increased to NT$ 297M
Qualified by ARM as its approved design center
2005
First 90nm project tape out
Complete a 180nm ASIC design service for a Japan IDM
2004
Sign an agreement with MIPS as its authorized design partner
Capital at par value increase to NT$ 227M
Deliver the most competitive RISC CPU hard core to MIPS
“Development project in DDR II 500 MHz registered buffer”received R&D subsidy from “Innovation Award”of Hsinchu Science Park Bureau
2003
Approved to register in and move to Hsin-chu Science Park
Invite strategic investors (VIS & CIDC) to restructure CMSC (total Cadence shares thus transfered to VIS & CIDC)
2001
A design service company, 100% founded by Cadence Design Systems Inc. and located in Taiwan